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Interfacial adhesion of copper-low k interconnects:

, In: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461),
Andideh, E. ; Scherban, T. ; Sun, B.... - p. 257,258,259 , 2001
Link: https://doi.org/10.1109/IITC.2001.930077