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1 Ergebnisse
1
Stress Evolution Analysis of EM-Induced Void Growth for Mul..:
, In:
2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)
,
Liu, Zaiyong
;
Chen, Hai-Bao
;
Hou, Tianshu
- p. 62-65 , 2020
Link:
https://doi.org/10.1109/APCCAS50809.2020.9301690
RT T1
2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)
: T1
Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires
UL https://suche.suub.uni-bremen.de/peid=ieee-9301690&Exemplar=1&LAN=DE A1 Liu, Zaiyong A1 Chen, Hai-Bao A1 Hou, Tianshu YR 2020 K1 Stress K1 Wires K1 Mathematical model K1 Analytical models K1 Metals K1 Power grids K1 Integrated circuit modeling SP 62 OP 65 LK http://dx.doi.org/https://doi.org/10.1109/APCCAS50809.2020.9301690 DO https://doi.org/10.1109/APCCAS50809.2020.9301690 SF ELIB - SuUB Bremen
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