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Deep Neural Network-based Lumped Circuit Modeling using Imp..:

, In: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Lho, Daehwan ; Park, Hyunwook ; Kim, Seongguk... - p. 1-3 , 2020
Link: https://doi.org/10.1109/EDAPS50281.2020.9312895