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1 Ergebnisse
1
Design and Analysis of Thermal Transmission Line based Embe..:
, In:
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Son, Keeyoung
;
Kim, Subin
;
Park, Shinyoung
... - p. 1-3 , 2020
Link:
https://doi.org/10.1109/EDAPS50281.2020.9312897
RT T1 <cTitle>2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)</cTitle>: T1 <Title>Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9312897&Exemplar=1&LAN=DE A1 Son, Keeyoung A1 Kim, Subin A1 Park, Shinyoung A1 Park, Hyunwook A1 Kim, Keunwoo A1 Shin, Taein A1 Kim, Minsu A1 Son, Kyungjune A1 Park, Gapyeol A1 Jeong, Seungtaek A1 Kim, Joungho YR 2020 SN 2151-1233 K1 Through-silicon vias K1 Cooling K1 System-on-chip K1 Integrated circuits K1 Thermal management K1 Heat transfer K1 Power transmission lines K1 High bandwidth memory K1 Junction temperature K1 Signal integrity K1 Thermal integrity K1 Thermal Transmission Line SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS50281.2020.9312897 DO https://doi.org/10.1109/EDAPS50281.2020.9312897 SF ELIB - SuUB Bremen
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