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1 Ergebnisse
1
New and Unique CMP Material Solution for the Enablement of ..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Chakraborty, Tapash
;
Goradia, Prerna
;
Verhaverbeke, Steven
... - p. 41-43 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9314866
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>New and Unique CMP Material Solution for the Enablement of High Removal Rate Polymer CMP and other Advanced Packaging Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9314866&Exemplar=1&LAN=DE A1 Chakraborty, Tapash A1 Goradia, Prerna A1 Verhaverbeke, Steven A1 Chen, Han-Wen A1 Buch, Chintan A1 Lianto, Prayudi YR 2020 K1 Slurries K1 Polymers K1 Packaging K1 Electromagnetic compatibility K1 Substrates K1 Abrasives K1 Surface topography SP 41 OP 43 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9314866 DO https://doi.org/10.1109/EPTC50525.2020.9314866 SF ELIB - SuUB Bremen
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