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Investigation of Thermal Performance of Antenna in Package ..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Han, Yong ; Chai, Tai Chong ; Lim, Teck Guan - p. 246-250 , 2020
Link: https://doi.org/10.1109/EPTC50525.2020.9314988