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1 Ergebnisse
1
Board Level Solder Joint Reliability Design and Analysis of..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Zhang, Xiaowu
;
Lau, Boon Long
;
Chen, Haoran
... - p. 316-320 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9314996
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Board Level Solder Joint Reliability Design and Analysis of FOWLP</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9314996&Exemplar=1&LAN=DE A1 Zhang, Xiaowu A1 Lau, Boon Long A1 Chen, Haoran A1 Han, Yong A1 Jong, Ming Chinq A1 Lim, Sharon Pei Siang A1 Lim, Simon Siak Boon A1 Wang, Xiaobai A1 Andriani, Yosephine A1 Liu, Songlin YR 2020 K1 Soldering K1 Reliability K1 Creep K1 Semiconductor device reliability K1 Strain K1 Packaging K1 Predictive models SP 316 OP 320 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9314996 DO https://doi.org/10.1109/EPTC50525.2020.9314996 SF ELIB - SuUB Bremen
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