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Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar In..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
de Saxce, Joseph M. ; Roux-Levy, Philippe ; Siah, Chun Fei... - p. 81-84 , 2020
Link: https://doi.org/10.1109/EPTC50525.2020.9314999