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1 Ergebnisse
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High performances 3D heterogeneous integrated devices based..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Jatlaoui, Mohamed Mehdi
;
Muller, Charles
- p. 266-267 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315000
RT T1
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
: T1
High performances 3D heterogeneous integrated devices based on 3D silicon capacitive interposer
UL https://suche.suub.uni-bremen.de/peid=ieee-9315000&Exemplar=1&LAN=DE A1 Jatlaoui, Mohamed Mehdi A1 Muller, Charles YR 2020 K1 Silicon K1 Capacitors K1 Radio frequency K1 Three-dimensional displays K1 DC-DC power converters K1 Integrated circuits K1 Through-silicon vias K1 Integrated Passive Devices K1 Through-Silicon Via K1 Wafer Level Chip Scale Package K1 Heterogeneous assembly K1 Silicon Interposer with Embedded Trench Capacitors SP 266 OP 267 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315000 DO https://doi.org/10.1109/EPTC50525.2020.9315000 SF ELIB - SuUB Bremen
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