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1 Ergebnisse
1
Electroless Plating with Copper Complex Ink as a Seed:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Chew, KaiHwa
;
Farraj, Yousef
;
Magdassi, Shlomo
- p. 36-40 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315010
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Electroless Plating with Copper Complex Ink as a Seed</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9315010&Exemplar=1&LAN=DE A1 Chew, KaiHwa A1 Farraj, Yousef A1 Magdassi, Shlomo YR 2020 K1 Copper K1 Three-dimensional displays K1 Printing K1 Substrates K1 Plasmas K1 Plating K1 Consumer electronics SP 36 OP 40 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315010 DO https://doi.org/10.1109/EPTC50525.2020.9315010 SF ELIB - SuUB Bremen
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