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1 Ergebnisse
1
Power Module on Copper Lead Frame with Novel Sintering Past..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Wai, Leong Ching
;
Yamamoto, Kazunori
;
Boon, Simon Lim Siak
. - p. 302-306 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315011
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Power Module on Copper Lead Frame with Novel Sintering Paste and SnSb solder</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9315011&Exemplar=1&LAN=DE A1 Wai, Leong Ching A1 Yamamoto, Kazunori A1 Boon, Simon Lim Siak A1 Yue, Tang Gong YR 2020 K1 Copper K1 Logic gates K1 Microassembly K1 Preforms K1 Lead K1 Integrated circuit interconnections K1 Soldering K1 Power device K1 Sintering K1 Lead-free solder K1 copper lead frame SP 302 OP 306 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315011 DO https://doi.org/10.1109/EPTC50525.2020.9315011 SF ELIB - SuUB Bremen
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