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1 Ergebnisse
1
Lidless and lidded Flip Chip Packages for Advanced Applicat..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Refai-Ahmed, Gamal
;
Wang, Huayan
;
Ramalingam, Suresh
... - p. 104-111 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315021
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Lidless and lidded Flip Chip Packages for Advanced Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9315021&Exemplar=1&LAN=DE A1 Refai-Ahmed, Gamal A1 Wang, Huayan A1 Ramalingam, Suresh A1 Karunakaran, Nagadeven A1 Pan, Ke A1 Park, SB A1 Soundarajan, Alegesen A1 Kanaran, Sreedharan Kelappen A1 Chung, C. Key A1 Huang, Yu Lung YR 2020 K1 Electronic packaging thermal management K1 Heating systems K1 Thermal resistance K1 Thermal conductivity K1 Flip-chip devices K1 Thermal loading K1 Surface resistance SP 104 OP 111 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315021 DO https://doi.org/10.1109/EPTC50525.2020.9315021 SF ELIB - SuUB Bremen
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