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1 Ergebnisse
1
Laser drilling and Plasma Cleaning Process for Blind Via Th..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Hsiao, Hsiang-Yao
;
Wee Ho, David Soon
;
Sing Lim, Keith Cheng
... - p. 14-18 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315051
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Laser drilling and Plasma Cleaning Process for Blind Via Through Mold Interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9315051&Exemplar=1&LAN=DE A1 Hsiao, Hsiang-Yao A1 Wee Ho, David Soon A1 Sing Lim, Keith Cheng A1 Chong, Ser Choong A1 Chai, Tai Chong A1 Schutzberger, David A1 Oz, Yariv A1 Amrani, Guy A1 Zhao, Jack A1 Toh, Johnson YR 2020 K1 Laser beams K1 Plasmas K1 Compounds K1 Drilling machines K1 Chemical lasers K1 Gas lasers K1 Copper SP 14 OP 18 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315051 DO https://doi.org/10.1109/EPTC50525.2020.9315051 SF ELIB - SuUB Bremen
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