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Investigation of Paramagnetic Defects in SiCN and SiCO-base..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Peng, L. ; Kim, S-W ; Iacovo, S.... - p. 464-467 , 2020
Link: https://doi.org/10.1109/EPTC50525.2020.9315054