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1 Ergebnisse
1
A Packaging Solution to Enable Moisture Sensitivity Level 1..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Li, Zhiwen
;
Yip, Shu Ming
;
Fung, Yee Wai
. - p. 135-139 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315066
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>A Packaging Solution to Enable Moisture Sensitivity Level 1 Zero Delamination for Leaded Surface Mount Device Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9315066&Exemplar=1&LAN=DE A1 Li, Zhiwen A1 Yip, Shu Ming A1 Fung, Yee Wai A1 Chen, Haibin YR 2020 K1 Delamination K1 Curing K1 Electromagnetic compatibility K1 Adhesives K1 Microassembly K1 Resins K1 Compounds SP 135 OP 139 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315066 DO https://doi.org/10.1109/EPTC50525.2020.9315066 SF ELIB - SuUB Bremen
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