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Strain Response of a Semiconductor Package during Drop Test..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Chen, C. M. ; Gan, C. L. ; Zou, Y.S... - p. 49-52 , 2020
Link: https://doi.org/10.1109/EPTC50525.2020.9315075