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Numerical analysis of a MEMS sensor's deformation behavior ..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Yalagach, Mahesh
;
Fuchs, Peter Filipp
;
Antretter, Thomas
.. - p. 380-385 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315091
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9315091&Exemplar=1&LAN=DE A1 Yalagach, Mahesh A1 Fuchs, Peter Filipp A1 Antretter, Thomas A1 Qi, Tao A1 Weber, Markus YR 2020 K1 Humidity K1 Strain K1 Moisture K1 Micromechanical devices K1 Temperature sensors K1 Load modeling K1 Capacitance K1 Moisture diffusion K1 advanced hygro-thermo-mechanical simulation K1 pressure sensor K1 die deformation K1 four-point bending SP 380 OP 385 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315091 DO https://doi.org/10.1109/EPTC50525.2020.9315091 SF ELIB - SuUB Bremen
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