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1 Ergebnisse
1
Epoxy Molding Compound Development for Improved MSL1 Delami..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Garete, April Joy
;
Li, Zhiwen
;
Taduran, Arnel
- p. 90-94 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315114
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Epoxy Molding Compound Development for Improved MSL1 Delamination Resistance in Plastic Encapsulated Clip Bond Power Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9315114&Exemplar=1&LAN=DE A1 Garete, April Joy A1 Li, Zhiwen A1 Taduran, Arnel YR 2020 K1 Stress K1 Moisture K1 Electromagnetic compatibility K1 Compounds K1 Delamination K1 Absorption K1 Indexes SP 90 OP 94 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315114 DO https://doi.org/10.1109/EPTC50525.2020.9315114 SF ELIB - SuUB Bremen
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