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A Study to Reduce Molding Film Defects During Vacuum Lamina..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Long, Lau Boon ; Ho, David ; Ps, Sharon Lim. - p. 130-134 , 2020
Link: https://doi.org/10.1109/EPTC50525.2020.9315116