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1 Ergebnisse
1
Reliability Study of Direct Au (Au-Cu plating) Surface Trea..:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
Ahn, Jae-Young
;
Kim, Jung-Yul
;
Kim, Young-Seok
... - p. 326-329 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315136
RT T1 <cTitle>2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Reliability Study of Direct Au (Au-Cu plating) Surface Treatment on PKG Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9315136&Exemplar=1&LAN=DE A1 Ahn, Jae-Young A1 Kim, Jung-Yul A1 Kim, Young-Seok A1 Moon, Jeong-Geun A1 Kwon, Oh-Gul A1 Park, Kyung-Yoon A1 Lee, Sun-Yong A1 Youm, Kwang-Seop A1 Jeong, Jee-Won A1 Ahn, Eun-Chul YR 2020 K1 Gold K1 Surface treatment K1 Wires K1 Reliability K1 Plating K1 Surface roughness K1 Rough surfaces K1 Direct Au K1 PKG Substrate K1 reliability analysis K1 gold wire bonding pull test K1 ball shear test SP 326 OP 329 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315136 DO https://doi.org/10.1109/EPTC50525.2020.9315136 SF ELIB - SuUB Bremen
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