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1 Ergebnisse
1
Fan-Out Wafer Level Packaging Development Line:
, In:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
,
TC, Chai
;
Ho, David
;
SC, Chong
... - p. 440-444 , 2020
Link:
https://doi.org/10.1109/EPTC50525.2020.9315155
RT T1
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
: T1
Fan-Out Wafer Level Packaging Development Line
UL https://suche.suub.uni-bremen.de/peid=ieee-9315155&Exemplar=1&LAN=DE A1 TC, Chai A1 Ho, David A1 SC, Chong A1 HY, Hsiao A1 Soh, Serine A1 Lim, Simon A1 PS, Sharon Lim A1 Wai, Eva A1 BL, Lau A1 WW, Seit A1 GK, Lau A1 TS, Phua A1 Lim, Keith A1 SH, Sharon Lim A1 YL, Ye YR 2020 K1 Conferences K1 Industries K1 Packaging K1 Electronics packaging K1 Electronic components K1 Wires K1 Antennas SP 440 OP 444 LK http://dx.doi.org/https://doi.org/10.1109/EPTC50525.2020.9315155 DO https://doi.org/10.1109/EPTC50525.2020.9315155 SF ELIB - SuUB Bremen
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