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High brightness and bonding yield of integrated Si-CMOS and..:

, In: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S),
Lee, Kwang Hong ; Zhang, Lin ; Zhang, Li... - p. 1-3 , 2019
Link: https://doi.org/10.1109/S3S46989.2019.9320500