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High Temperature Reliability Studies of Innovative Fuse Pro..:

, In: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S),
Chung, Shine ; Fang, Wen-Kuan ; Wendt, Michael. - p. 1-2 , 2019
Link: https://doi.org/10.1109/S3S46989.2019.9320721