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1 Ergebnisse
1
Heterogeneous Multi-Dimensional Integrated Circuit for Inte..:
, In:
2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
,
El-Atab, Nazek
;
Shaikh, Sohail F.
;
Khan, Sherjeel
.. - p. 1-2 , 2019
Link:
https://doi.org/10.1109/S3S46989.2019.9320723
RT T1
2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
: T1
Heterogeneous Multi-Dimensional Integrated Circuit for Internet-of-Things Application
UL https://suche.suub.uni-bremen.de/peid=ieee-9320723&Exemplar=1&LAN=DE A1 El-Atab, Nazek A1 Shaikh, Sohail F. A1 Khan, Sherjeel A1 Yun, Joho A1 Hussain, Muhammad Mustafa YR 2019 K1 STEM K1 Silicon K1 Through-silicon vias K1 Integrated circuits K1 Integrated circuit interconnections K1 Faces K1 Microcontrollers K1 3D integration K1 packaging K1 heterogeneous K1 TSVs K1 reliability test SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/S3S46989.2019.9320723 DO https://doi.org/10.1109/S3S46989.2019.9320723 SF ELIB - SuUB Bremen
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