I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

A Lumped Element Model for the Damping Mechanism of Micro-o..:

, In: 2020 32nd International Conference on Microelectronics (ICM),
Zengerle, Tobias ; Joppich, Julian ; Lensch, Henrik.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/ICM50269.2020.9331778