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1 Ergebnisse
1
High Quality Integrated Inductor in Fan-out Wafer-Level Pac..:
, In:
2020 50th European Microwave Conference (EuMC)
,
Murugesan, Kavin Senthil
;
Chernobryvko, Mykola
;
Zinal, Sherko
... - p. 89-92 , 2021
Link:
https://doi.org/10.23919/EuMC48046.2021.9337984
RT T1
2020 50th European Microwave Conference (EuMC)
: T1
High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9337984&Exemplar=1&LAN=DE A1 Murugesan, Kavin Senthil A1 Chernobryvko, Mykola A1 Zinal, Sherko A1 Rossi, Marco A1 Ndip, Ivan A1 Boettcher, Mathias A1 Lang, Klaus Dieter A1 Wieland, Marcel A1 Goetze, Christian A1 Halim, Saquib Bin A1 Trewhella, Jean YR 2021 K1 Semiconductor device modeling K1 Q-factor K1 Correlation K1 Spirals K1 Polyimides K1 Wafer scale integration K1 Inductors K1 5G K1 mm-Wave K1 mobile communication K1 inductors K1 quality factor K1 inductance K1 polyimide K1 packaging K1 FoWLP K1 multilayer SP 89 OP 92 LK http://dx.doi.org/https://doi.org/10.23919/EuMC48046.2021.9337984 DO https://doi.org/10.23919/EuMC48046.2021.9337984 SF ELIB - SuUB Bremen
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