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1 Ergebnisse
1
DC-to-Ka-band Broadband Chip-to-Chip Interconnect Using Aer..:
, In:
2020 50th European Microwave Conference (EuMC)
,
Qayyum, Jubaid Abdul
;
Crump, Cameron
;
Albrecht, John
.. - p. 252-255 , 2021
Link:
https://doi.org/10.23919/EuMC48046.2021.9338006
RT T1
2020 50th European Microwave Conference (EuMC)
: T1
DC-to-Ka-band Broadband Chip-to-Chip Interconnect Using Aerosol Jet Printing
UL https://suche.suub.uni-bremen.de/peid=ieee-9338006&Exemplar=1&LAN=DE A1 Qayyum, Jubaid Abdul A1 Crump, Cameron A1 Albrecht, John A1 Ulusoy, Ahmet Cagri A1 Papapolymerou, John YR 2021 K1 Printing K1 Semiconductor device measurement K1 Aerosols K1 Dielectric loss measurement K1 Broadband communication K1 Coplanar waveguides K1 Substrates K1 Aerosol jet printing (AJP) K1 additive manufacturing (AM) K1 interconnect K1 system-on-package (SoP) SP 252 OP 255 LK http://dx.doi.org/https://doi.org/10.23919/EuMC48046.2021.9338006 DO https://doi.org/10.23919/EuMC48046.2021.9338006 SF ELIB - SuUB Bremen
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