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Rational Engineering of the Dielectric Properties of Thin S..:

, In: 2020 IEEE 3rd International Conference on Dielectrics (ICD),
Rigoudy, C. ; Makasheva, K. ; Belhaj, M.... - p. 205-208 , 2020
Link: https://doi.org/10.1109/ICD46958.2020.9341862