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Simulation Assisted Characterization of Attenuation at Micr..:
, In:
2021 14th International Congress Molded Interconnect Devices (MID)
,
Wang, Li
;
Lomakin, Konstantin
;
Job, Alexander
... - p. 1-3 , 2021
Link:
https://doi.org/10.1109/MID50463.2021.9361617
RT T1 <cTitle>2021 14th International Congress Molded Interconnect Devices (MID)</cTitle>: T1 <Title>Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9361617&Exemplar=1&LAN=DE A1 Wang, Li A1 Lomakin, Konstantin A1 Job, Alexander A1 Suess-Wolf, Robert A1 Gold, Gerald A1 Franke, Jorg YR 2021 K1 Power transmission lines K1 Surface waves K1 Attenuation K1 Transmission line measurements K1 Laser modes K1 Surface roughness K1 Surface treatment K1 component K1 formatting K1 style K1 styling SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/MID50463.2021.9361617 DO https://doi.org/10.1109/MID50463.2021.9361617 SF ELIB - SuUB Bremen
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