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1 Ergebnisse
1
F5: Enabling New System Architectures with 2.5D, 3D, and Ch..:
, In:
2021 IEEE International Solid-State Circuits Conference (ISSCC)
,
Gonzalez, Christopher
;
Liu, Huichu
;
Noh, Mijung
... - p. 529-532 , 2021
Link:
https://doi.org/10.1109/ISSCC42613.2021.9365834
RT T1 <cTitle>2021 IEEE International Solid-State Circuits Conference (ISSCC)</cTitle>: T1 <Title>F5: Enabling New System Architectures with 2.5D, 3D, and Chiplets</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9365834&Exemplar=1&LAN=DE A1 Gonzalez, Christopher A1 Liu, Huichu A1 Noh, Mijung A1 Karl, Eric A1 Toifl, Thomas A1 Hsu, Shawn YR 2021 SN 2376-8606 K1 Three-dimensional displays K1 Integrated circuit interconnections K1 Computer architecture K1 Packaging K1 Integrated circuits K1 Conferences K1 Random access memory SP 529 OP 532 LK http://dx.doi.org/https://doi.org/10.1109/ISSCC42613.2021.9365834 DO https://doi.org/10.1109/ISSCC42613.2021.9365834 SF ELIB - SuUB Bremen
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