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Development of an In-Line Capable Transient Thermal Analysi..:

, In: 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Schmid, Maximilian ; Bhogaraju, Sri Krishna ; Riedel, Andreas. - p. 1-6 , 2020
Link: https://doi.org/10.1109/THERMINIC49743.2020.9420493