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Stress adjusting for hillock size reduction in UTS CIS base..:

, In: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Hu, Xianghua ; He, Guangzhi ; Gu, Xiaofang. - p. 1-3 , 2021
Link: https://doi.org/10.1109/EDTM50988.2021.9420834