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1 Ergebnisse
1
Fan-Out Wafer and Panel Level Packaging - A Platform for 3D..:
, In:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Braun, Tania
;
Becker, Karl-Friedrich
;
Topper, Michael
.. - p. 1-3 , 2021
Link:
https://doi.org/10.1109/EDTM50988.2021.9420895
RT T1 <cTitle>2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</cTitle>: T1 <Title>Fan-Out Wafer and Panel Level Packaging - A Platform for 3D Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9420895&Exemplar=1&LAN=DE A1 Braun, Tania A1 Becker, Karl-Friedrich A1 Topper, Michael A1 Aschenbrenner, Rolf A1 Schneider-Ramelow, Martin YR 2021 K1 Electric potential K1 Three-dimensional displays K1 Stacking K1 System integration K1 Packaging K1 Market research K1 Routing SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDTM50988.2021.9420895 DO https://doi.org/10.1109/EDTM50988.2021.9420895 SF ELIB - SuUB Bremen
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