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1 Ergebnisse
1
Better Warpage Control by Using Low Temperature Solder for ..:
, In:
2021 International Conference on Electronics Packaging (ICEP)
,
Lai, Da-Sheng
;
Lee, Jackson
;
Huang, Joe
. - p. 135-136 , 2021
Link:
https://doi.org/10.23919/ICEP51988.2021.9451950
RT T1 <cTitle>2021 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Better Warpage Control by Using Low Temperature Solder for Large FCBGA Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9451950&Exemplar=1&LAN=DE A1 Lai, Da-Sheng A1 Lee, Jackson A1 Huang, Joe A1 Wang, Yu-Po YR 2021 K1 Heating systems K1 Thermal expansion K1 Metals K1 Market research K1 Product design K1 Reliability K1 Soldering K1 Low temp solder K1 Sn-Bi alloy K1 Exposed die structure K1 Warpage K1 Large FCBGA SP 135 OP 136 LK http://dx.doi.org/https://doi.org/10.23919/ICEP51988.2021.9451950 DO https://doi.org/10.23919/ICEP51988.2021.9451950 SF ELIB - SuUB Bremen
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