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1 Ergebnisse
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A Study of Factors Affecting Process-Induced Warpage Behavi..:
, In:
2021 International Conference on Electronics Packaging (ICEP)
,
Chen, Yi-Huang
;
Tai, Ling-Ching
;
Liu, Yan-Cheng
. - p. 105-106 , 2021
Link:
https://doi.org/10.23919/ICEP51988.2021.9451980
RT T1 <cTitle>2021 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>A Study of Factors Affecting Process-Induced Warpage Behavior of Flip Chip Package on Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9451980&Exemplar=1&LAN=DE A1 Chen, Yi-Huang A1 Tai, Ling-Ching A1 Liu, Yan-Cheng A1 Cheng, Hsien-Chie YR 2021 K1 Fabrication K1 Analytical models K1 Parametric study K1 Computational modeling K1 Predictive models K1 Mechanical factors K1 Finite element analysis K1 Flip Chip Package on Package K1 Warpage K1 Process Simulation K1 Finite Element Method K1 Effective Modeling SP 105 OP 106 LK http://dx.doi.org/https://doi.org/10.23919/ICEP51988.2021.9451980 DO https://doi.org/10.23919/ICEP51988.2021.9451980 SF ELIB - SuUB Bremen
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