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Development of High Reliability Joint of Sn-Bi Solder for 2..:
, In:
2021 International Conference on Electronics Packaging (ICEP)
,
Miki, Shota
;
Kawakami, Koyuki
;
Murayama, Kei
. - p. 91-92 , 2021
Link:
https://doi.org/10.23919/ICEP51988.2021.9451985
RT T1 <cTitle>2021 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Development of High Reliability Joint of Sn-Bi Solder for 2.3D Organic Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9451985&Exemplar=1&LAN=DE A1 Miki, Shota A1 Kawakami, Koyuki A1 Murayama, Kei A1 Oi, Kiyoshi YR 2021 K1 Resistance K1 Materials reliability K1 Compounds K1 Soldering K1 Bonding K1 Thermal stability K1 Electronics packaging K1 Organic Interposer K1 Sn-Bi Solder K1 Intermetallic Compounds K1 Low temperature bonding SP 91 OP 92 LK http://dx.doi.org/https://doi.org/10.23919/ICEP51988.2021.9451985 DO https://doi.org/10.23919/ICEP51988.2021.9451985 SF ELIB - SuUB Bremen
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