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Investigation on the Impact of Environmental Stress on the ..:
, In:
2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
,
Hoffmann, Felix
;
Kaminski, Nando
;
Schmitt, Stefan
- p. 371-374 , 2021
Link:
https://doi.org/10.23919/ISPSD50666.2021.9452227
RT T1 <cTitle>2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD)</cTitle>: T1 <Title>Investigation on the Impact of Environmental Stress on the Thermo-Mechanical Reliability of IGBTs by Means of Consecutive H3TRB and PCT Testing</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9452227&Exemplar=1&LAN=DE A1 Hoffmann, Felix A1 Kaminski, Nando A1 Schmitt, Stefan YR 2021 SN 1946-0201 K1 Insulated gate bipolar transistors K1 Degradation K1 Thermomechanical processes K1 Wind power generation K1 Silicon K1 Power semiconductor devices K1 Reliability K1 IGBT K1 power module K1 reliability K1 power cycling K1 H3TRB K1 humidity K1 combined testing SP 371 OP 374 LK http://dx.doi.org/https://doi.org/10.23919/ISPSD50666.2021.9452227 DO https://doi.org/10.23919/ISPSD50666.2021.9452227 SF ELIB - SuUB Bremen
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