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1 Ergebnisse
1
Evaluation of Low-Pressure-Sintered Multi-Layer Substrates ..:
, In:
2021 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Gersh, Jacob
;
DiMarino, Christina
;
DeVoto, Douglas
... - p. 20-26 , 2021
Link:
https://doi.org/10.1109/APEC42165.2021.9487244
RT T1 <cTitle>2021 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>Evaluation of Low-Pressure-Sintered Multi-Layer Substrates for Medium-Voltage SiC Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9487244&Exemplar=1&LAN=DE A1 Gersh, Jacob A1 DiMarino, Christina A1 DeVoto, Douglas A1 Paret, Paul A1 Major, Joshua A1 Gage, Samuel YR 2021 SN 2470-6647 K1 Silver K1 Scanning electron microscopy K1 Silicon carbide K1 Preforms K1 Thermomechanical processes K1 Multichip modules K1 Medium voltage K1 power module K1 preform K1 silicon carbide K1 reliability K1 silver sintering K1 stacked substrates SP 20 OP 26 LK http://dx.doi.org/https://doi.org/10.1109/APEC42165.2021.9487244 DO https://doi.org/10.1109/APEC42165.2021.9487244 SF ELIB - SuUB Bremen
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