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1 Ergebnisse
1
Advanced 2.5D Heterogeneous Integrated Platform Using Flexi..:
, In:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
,
Ku, Shu-Yun
;
Tsai, Yi-Chieh
;
Chou, Tzu-Chieh
... - p. 1020-1025 , 2021
Link:
https://doi.org/10.1109/ECTC32696.2021.00167
RT T1 <cTitle>2021 IEEE 71st Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Advanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9501849&Exemplar=1&LAN=DE A1 Ku, Shu-Yun A1 Tsai, Yi-Chieh A1 Chou, Tzu-Chieh A1 Hu, Han-Wen A1 Fang, Yu-Ren A1 Lin, Yu-Ju A1 Huang, Po-Tsang A1 Chiou, Jin-Chern A1 Chen, Kuan-Neng YR 2021 SN 2377-5726 K1 Performance evaluation K1 Conferences K1 Electronic components K1 Thermal conductivity K1 Light emitting diodes K1 Sensors K1 Thermal analysis K1 Heterogeneous integration K1 Biocompatible K1 Bendable interconnect K1 SU-8 K1 Flexible device SP 1020 OP 1025 LK http://dx.doi.org/https://doi.org/10.1109/ECTC32696.2021.00167 DO https://doi.org/10.1109/ECTC32696.2021.00167 SF ELIB - SuUB Bremen
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