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1 Ergebnisse
1
Fluorescence Microscopy Methodology for Visualizing Microsc..:
, In:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Quach, Nhi
;
Kim, Ilhwan
;
Chang, Jong-Hyeon
... - p. 1154-1161 , 2021
Link:
https://doi.org/10.1109/ITherm51669.2021.9503140
RT T1 <cTitle>2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Fluorescence Microscopy Methodology for Visualizing Microscale Interfacial Defects In Packaging Materials</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9503140&Exemplar=1&LAN=DE A1 Quach, Nhi A1 Kim, Ilhwan A1 Chang, Jong-Hyeon A1 Lee, ChungSun A1 Kang, Un-Byoung A1 Lee, JongHo A1 Won, Yoonjin YR 2021 SN 2694-2135 K1 Silicon compounds K1 Visualization K1 Adhesives K1 Microscopy K1 Fluorescence K1 Packaging K1 Surface roughness K1 fluorescence microscopy K1 adhesion SP 1154 OP 1161 LK http://dx.doi.org/https://doi.org/10.1109/ITherm51669.2021.9503140 DO https://doi.org/10.1109/ITherm51669.2021.9503140 SF ELIB - SuUB Bremen
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