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1 Ergebnisse
1
Combined Electromigration and Strain Accelerated Failure Te..:
, In:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Vinson, Whit
;
Iradukunda, Ange
;
Huitink, David
... - p. 772-779 , 2021
Link:
https://doi.org/10.1109/ITherm51669.2021.9503165
RT T1 <cTitle>2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9503165&Exemplar=1&LAN=DE A1 Vinson, Whit A1 Iradukunda, Ange A1 Huitink, David A1 Lee, Jong-Pil A1 Kwon, Minho A1 Oh, Chang-Yeol YR 2021 SN 2694-2135 K1 Electromigration K1 Power system measurements K1 Density measurement K1 Wires K1 Life estimation K1 Inverters K1 Reliability K1 wire bonds K1 SiC MOSFET K1 Black's Law SP 772 OP 779 LK http://dx.doi.org/https://doi.org/10.1109/ITherm51669.2021.9503165 DO https://doi.org/10.1109/ITherm51669.2021.9503165 SF ELIB - SuUB Bremen
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