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Impact of Squeezing on the Microstructure of Thermal Interf..:
, In:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Kantharaj, Rajath
;
Wassgren, Carl
;
Morris, Aaron
. - p. 1241-1249 , 2021
Link:
https://doi.org/10.1109/ITherm51669.2021.9503232
RT T1 <cTitle>2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Impact of Squeezing on the Microstructure of Thermal Interface Materials</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9503232&Exemplar=1&LAN=DE A1 Kantharaj, Rajath A1 Wassgren, Carl A1 Morris, Aaron A1 Marconnet, Amy YR 2021 SN 2694-2135 K1 Graphical models K1 Shape K1 Thermomechanical processes K1 Tomography K1 Thermal conductivity K1 Electronic packaging thermal management K1 Polymers K1 particle laden polymeric TIMs K1 squeezing-induced particle heterogeneity K1 X-ray micro computed tomography K1 microstructure analysis of dispensed and squeezed TIMs SP 1241 OP 1249 LK http://dx.doi.org/https://doi.org/10.1109/ITherm51669.2021.9503232 DO https://doi.org/10.1109/ITherm51669.2021.9503232 SF ELIB - SuUB Bremen
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