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1 Ergebnisse
1
Electrically Conductive Adhesive Interconnections on Additi..:
, In:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Lall, Pradeep
;
Goyal, Kartik
;
Schulze, Kyle
. - p. 807-817 , 2021
Link:
https://doi.org/10.1109/ITherm51669.2021.9503235
RT T1 <cTitle>2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Electrically Conductive Adhesive Interconnections on Additively Printed Substrates</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9503235&Exemplar=1&LAN=DE A1 Lall, Pradeep A1 Goyal, Kartik A1 Schulze, Kyle A1 Miller, Scott YR 2021 SN 2694-2135 K1 Printing K1 Viscosity K1 Metallization K1 Thermomechanical processes K1 Thermal conductivity K1 Manufacturing K1 Copper K1 inkjet K1 direct write K1 printed electronics K1 flexible substrate K1 conductive adhesive K1 surface mount devices K1 satellite drops K1 droplet behavior SP 807 OP 817 LK http://dx.doi.org/https://doi.org/10.1109/ITherm51669.2021.9503235 DO https://doi.org/10.1109/ITherm51669.2021.9503235 SF ELIB - SuUB Bremen
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