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1 Ergebnisse
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Optimization of hotspot location on multi stacked board of ..:
, In:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Cho, Youngsang
;
Yoo, Jongkyu
;
Im, Yunhyeok
... - p. 484-490 , 2021
Link:
https://doi.org/10.1109/ITherm51669.2021.9503236
RT T1
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Optimization of hotspot location on multi stacked board of mobile phone
UL https://suche.suub.uni-bremen.de/peid=ieee-9503236&Exemplar=1&LAN=DE A1 Cho, Youngsang A1 Yoo, Jongkyu A1 Im, Yunhyeok A1 An, Taekeun A1 Lee, Heeseok A1 Heo, Yun YR 2021 SN 2694-2135 K1 Heating systems K1 Temperature K1 Power demand K1 5G mobile communication K1 Shape K1 Thermomechanical processes K1 Stacking K1 Floorplanning K1 PCB K1 Mobile phone K1 Thermal K1 Package K1 AP K1 PMIC K1 Memory K1 5G K1 Modem K1 CFD SP 484 OP 490 LK http://dx.doi.org/https://doi.org/10.1109/ITherm51669.2021.9503236 DO https://doi.org/10.1109/ITherm51669.2021.9503236 SF ELIB - SuUB Bremen
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