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1 Ergebnisse
1
Evolution of High-Temperature and Low-Temperature High Stra..:
, In:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Lall, Pradeep
;
Saha, Mrinmoy
;
Suhling, Jeff
. - p. 719-728 , 2021
Link:
https://doi.org/10.1109/ITherm51669.2021.9503301
RT T1 <cTitle>2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9503301&Exemplar=1&LAN=DE A1 Lall, Pradeep A1 Saha, Mrinmoy A1 Suhling, Jeff A1 Blecker, Ken YR 2021 SN 2694-2135 K1 Temperature measurement K1 Degradation K1 Temperature distribution K1 Biological system modeling K1 Computational modeling K1 Predictive models K1 Aging K1 SAC-R K1 High strain rate Testing K1 Low temperature testing K1 Thermal aging K1 Anand Viscoplastic Model K1 Stress Strain curves K1 Lead Free Solder joint SP 719 OP 728 LK http://dx.doi.org/https://doi.org/10.1109/ITherm51669.2021.9503301 DO https://doi.org/10.1109/ITherm51669.2021.9503301 SF ELIB - SuUB Bremen
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