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1 Ergebnisse
1
In-situ Electrothermal TEM Investigation of Electromigratio..:
, In:
2020 IEEE International Interconnect Technology Conference (IITC)
,
Lee, Miji
;
Chung, Do Hwan
;
Kim, Hyo-Young
... - p. 127-129 , 2020
Link:
https://doi.org/10.1109/IITC47697.2020.9515592
RT T1 <cTitle>2020 IEEE International Interconnect Technology Conference (IITC)</cTitle>: T1 <Title>In-situ Electrothermal TEM Investigation of Electromigration in fully Embedded Cu/Co Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9515592&Exemplar=1&LAN=DE A1 Lee, Miji A1 Chung, Do Hwan A1 Kim, Hyo-Young A1 Lee, Mi-Ji A1 Lee, Moonsoo A1 Kim, Jinseok A1 Kang, Hanbyul A1 Rhee, Hwasung A1 Pae, Sangwoo YR 2020 SN 2380-6338 K1 Electromigration K1 Visualization K1 Surface contamination K1 Milling K1 Cleaning K1 Reliability K1 Mechanical systems K1 In-situ TEM K1 electro-migration (EM) K1 Cobalt capping K1 Cu interconnects K1 diffusion path SP 127 OP 129 LK http://dx.doi.org/https://doi.org/10.1109/IITC47697.2020.9515592 DO https://doi.org/10.1109/IITC47697.2020.9515592 SF ELIB - SuUB Bremen
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