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1 Ergebnisse
1
Electromigration Void Behavior Revisited:
, In:
2020 IEEE International Interconnect Technology Conference (IITC)
,
Witt, C.
- p. 130-132 , 2020
Link:
https://doi.org/10.1109/IITC47697.2020.9515626
RT T1 <cTitle>2020 IEEE International Interconnect Technology Conference (IITC)</cTitle>: T1 <Title>Electromigration Void Behavior Revisited</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9515626&Exemplar=1&LAN=DE A1 Witt, C. YR 2020 SN 2380-6338 K1 Electromigration K1 Temperature dependence K1 Extrapolation K1 Systematics K1 Shape K1 Critical current density (superconductivity) K1 Conferences K1 Scaling K1 Reliability K1 Voiding SP 130 OP 132 LK http://dx.doi.org/https://doi.org/10.1109/IITC47697.2020.9515626 DO https://doi.org/10.1109/IITC47697.2020.9515626 SF ELIB - SuUB Bremen
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