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Hybrid Metallization with Cu in sub 30nm Interconnects:

, In: 2020 IEEE International Interconnect Technology Conference (IITC),
van der Veen, Marleen H. ; Soethoudt, J. ; Delabie, A.... - p. 16-18 , 2020
Link: https://doi.org/10.1109/IITC47697.2020.9515643