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Impacts of Misalignment on 1μm Pitch Cu-Cu Hybrid Bonding:

, In: 2020 IEEE International Interconnect Technology Conference (IITC),
Kagawa, Y. ; Hashiguchi, H. ; Kamibayashi, T.... - p. 148-150 , 2020
Link: https://doi.org/10.1109/IITC47697.2020.9515663