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1 Ergebnisse
1
Fabrication and Characterization of ISC embedded Interposer..:
, In:
2021 IEEE International Interconnect Technology Conference (IITC)
,
Park, Won Ji
;
Kang, Min Guk
;
Oh, Jae Hee
... - p. 1-3 , 2021
Link:
https://doi.org/10.1109/IITC51362.2021.9537342
RT T1 <cTitle>2021 IEEE International Interconnect Technology Conference (IITC)</cTitle>: T1 <Title>Fabrication and Characterization of ISC embedded Interposer for High Performance Interconnection</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9537342&Exemplar=1&LAN=DE A1 Park, Won Ji A1 Kang, Min Guk A1 Oh, Jae Hee A1 Ding, Shaofeng A1 Kim, Ji Hyung A1 Hwang, Je Gwan A1 Choi, Yun Ki A1 Park, Jung Ho A1 Lee, Won Hyoung A1 Nam, Seung Ki A1 Moon, Seong Wook A1 Youn, Jong Mil A1 Ahn, Jeong Hoon YR 2021 SN 2380-6338 K1 Temperature measurement K1 Wiring K1 Resistance K1 Temperature dependence K1 System performance K1 Capacitors K1 Semiconductor device reliability K1 Integrated stack capacitor (ISC) K1 capacitor K1 Interposer SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IITC51362.2021.9537342 DO https://doi.org/10.1109/IITC51362.2021.9537342 SF ELIB - SuUB Bremen
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